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PDM Product-level Solution
PDM Product-level Solution

PDM Product-level Solution

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Built on a new-generation multi-core MCU, the solution integrates MCU control, BMS and VCU functions while optimizing the power topology to reduce total system cost.
support@e-tronic.com.cn
Detail

This PDM solution integrates the functions of OBC and DC/DC into a single structure through magnetic integration technology, and enables the reuse of part of power devices, which is different from the physical integration solutions available in the market.


Meanwhile, the solution supports single-phase/three-phase input. Adopting automotive-grade silicon carbide devices, as well as ASIL-D compliant multi-core main control chips and power management chips, it realizes real-time control of the power electronic unit (OBC+DC/DC), system communication, safety monitoring and other functions with a single main control chip, which simplifies system design.


With fully digital control and a three-layer functional safety monitoring architecture, it meets product requirements of high safety, high power density, high efficiency, high power factor and low harmonic distortion.


Product Features

Technical Parameters

Main Control Chip: SPC58NN Multi-core Chip

Functional Safety Chip: L9396

Driver Chip: L9501

SiC Device: SCTW10ON120G2AG

Input Characteristics: 85~265V AC for single-phase; 304~456V AC for three-phase

Output Characteristics: 220~490V DC; 6kW for single-phase; 11kW for three-phase

Rated Efficiency: OBC ≥ 95%; DC/DC ≥ 94%

Functional Safety: OBC: ASIL B; DC/DC: ASIL C

AUTOSAR: Supported


Address: Room 306, Self-compiled, Building B9, No. 11 Kaiyuan Avenue, Huangpu District, Guangzhou City
Email: support@e-tronic.com.cn
Cooperation Hotline:

020-31603014