E-tronic focuses on the development of power semiconductors and controller systems, relying on the guidance and support by the chief scientist of the national major science and technology project, providing customers with services such as power module packaging design, trial production, drive system development, and manufacturing, aiming to help customers achieve industry leadership and build a domestic automotive semiconductor ecosystem.

E-Tronic already established an internationally advanced automotive-grade power module packaging production line with advanced process technology capabilities such as chip placement, screen printing, pressure-assisted silver sintering, vacuum welding, copper wire bonding, vacuum encapsulation, transfer molding, and non-destructive testing. E-tronic has also invested in key testing equipment such as dynamic and static testing, power cycling, and reactive aging, and have packaging testing capabilities for housing and transfer molding structures, enabling them to achieve full-process packaging manufacturing. E-Tronic has built the first large-area silver sintering production line for SiC TPAK power modules in China, introducing international advanced packaging technology and successfully achieving industrialization. Based on the above, E-Tronic has launched a series of automotive-grade power module/module products.